AM EXPO - OSAKA 2026
- DateApril 15 - 17, 2026
- Cycleonce a year
- CityOsaka (Japan)
- Address1-5-102 Nanko-Kita, Suminoe-ku Osaka, 559-0034 Japan
- Expo hallIntex Osaka
- OrganizerJDMA (Japan Die & Mold Industry Association)
- HomepageVisit the official website
1
Powder Packaging Line/ Pharmaceutical Packing Machinery/equipement
2
Server HUAWEI FusionServer RH2288H V3 Rack server
3
Natural Terminal Laser arthritis pain relief / frozen shoulder pain relief
4
5 Strap Bread Loaf Mold Set 1 1/2 lb.
5
A-line Wide Straps Tea-length Taffeta Lace Ribbons Flower Girl Dress
6
High performance aluminum auto radiator for FORD BRONCO DPI
7
222Ladies Quilted Jacket
8
filing furniture
9
Perforated Metal Tube
10
Woven Copper Wire Mesh
contacts：JDMA(JapanDie&MoldIndustry
Telephone：81666128686（Visible to members）
E-mail：info-jp@jdmia.or.jp
Sponsor：JDMA (Japan Die & Mold Industry Association)
Address：6F Kanagata Nenkin Bldg. 33-12 Yushima, 2-Chome Bunkyo-ku Tokyo 113－0034 Japan
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